arrow
conact_click open
In order to improve your experience and our services, we use cookies on our website. By continuing to browse and interact on this website you agree to our privacy policy.

Key Features

  • icon 3D board model
  • icon Independent of electronic CAD systems
  • icon High resolution virtual thermograph result
  • icon DC Voltage drop and distribution
  • icon Electric (Joule) heating in traces
  • icon All traces and components
  • icon Coupling to various environment conditions
  • icon Steady state and transient
  • icon Temperature feed-back on electric properties
  • icon Interfaced with Altium Designer
  • icon Drawing board
  • icon Affordable
(PDN) Voltage Current Tempreature
Gerber Drill Files IDF Manual Input CSV and Ascii
Amoress, Volts Watts, Ambient Conditions
Altium Designer DXO and OUTjob Your own Secripts

Thermal Management with TRM is: All Details 3D Electrricity + Tempreture

Benefits

Benefits

The calculated thermographs comes in high-resolution with visualized hotspots and identified regions of thermo-mechanical stress, caused by high temperature gradients. The calculated current density picture shows where the electric bottleneck creates hotspot and where constrictions have no concern. This cannot be achieved by any automated design rule check. By changing layer thickness, number of layers or environment conditions can explore the thermal limits of the board. Proper combination of actions can result in savings the raw material, machine drilling time or a better soldering result.

Boards TRM can handle boards with

  • icon Single Layers
  • icon Multilayers
  • icon SMD Components
  • icon Embedded Components
  • icon Heat Sinks
  • icon Cables
  • icon Pins
  • icon Inlays
  • icon Bus Bars
  • icon Special Copper Thickness
  • icon Chassis Parts and Bolts
  • icon Adhesives
  • icon Selection of materials
  • icon Plugged and Unplugged
  • icon Blind and Buried Vias
  • icon Insulated Metal Substrate

Steps that are needed to achieve temperature compliance

The TRM software can simulate all types of multilayers, SMD components, embedded passives, pins, Inlays, bus bars, adhesives, plugged and unplugged, blind and buried vias, as long as the PCB ismore or less flat. Compare technologies yourself and test what is coolest and what is an economically reasonable compromise.

  • icon Check the Drilling
  • icon Cost of Material
  • icon Number of Layers
  • icon Foot Print Area