Thermal Management with TRM is: All Details 3D Electrricity + Tempreture
The calculated thermographs comes in high-resolution with visualized hotspots and identified regions of thermo-mechanical stress, caused by high temperature gradients. The calculated current density picture shows where the electric bottleneck creates hotspot and where constrictions have no concern. This cannot be achieved by any automated design rule check. By changing layer thickness, number of layers or environment conditions can explore the thermal limits of the board. Proper combination of actions can result in savings the raw material, machine drilling time or a better soldering result.
The TRM software can simulate all types of multilayers, SMD components, embedded passives, pins, Inlays, bus bars, adhesives, plugged and unplugged, blind and buried vias, as long as the PCB ismore or less flat. Compare technologies yourself and test what is coolest and what is an economically reasonable compromise.